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VLSI Design- Questions with Answers for Electronics / VLSI Students
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VLSI Questions and Answers – VLSI Design
This set of VLSI Multiple Choice Questions & Answers (MCQs) focuses on “VLSI Design”.
7. What is the design flow of VLSI system?
Sanfoundry Global Education & Learning Series – VLSI.
To practice all areas of VLSI, here is complete set of 1000+ Multiple Choice Questions and Answers .
- Practice Electrical & Electronics Engineering MCQs
- Apply for Electrical & Electronics Engineering Internship
- Check VLSI Books
- Check Electrical & Electronics Engineering Books
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- Electronics & Communication Engineering
- VLSI Technology (Video)
- Co-ordinated by : IIT Madras
- Available from : 2009-12-31
- Introduction on VLSI Design
- Bipolar Junction Transistor Fabrication
- MOSFET Fabrication for IC
- Crystal Structure of Si
- Crystal Structure contd
- Defects in Crystal + Crystal growth
- Crystal growth Contd + Epitaxy I
- Epitaxy II - Vapour phase Epitaxy
- Epitaxy III - Doping during Epitaxy
- Molecular beam Epitaxy
- Oxidation I - Kinetics of Oxidation
- Oxidation II Oxidation rate constants
- Oxidation III - Dopant Redistribution
- Oxidation IV - Oxide Charges
- Diffusion I - Theory of Diffusion
- Diffusion II - Infinite Source
- Diffusion III - Actual Doping Profiles
- Diffusion IV Diffusion Systems
- Ion - Implantation Process
- Annealing of Damages
- Masking during Implantation
- Lithography - I
- Lithography - II
- Wet Chemical Etching
- Dry Etching
- Plasma Etching Systems
- Etching of Si,Sio2,SiN and other materials
- Plasma Deposition Process
- Metallization - I
- Problems in Aluminium Metal contacts
- IC BJT - From junction isolation to LOCOS
- Problems in LOCOS + Trench isolation
- More about BJT Fabrication and Realization
- Circuits + Transistors in ECL Circuits
- MOSFET I - Metal gate vs. Self-aligned Poly-gate
- MOSFET II Tailoring of Device Parameters
- CMOS Technology
- Latch - up in CMOS
- BICMOS Technology
- Watch on YouTube
- Assignments
- Transcripts
| Module Name | Download |
|---|---|
| Assignment 2-VLSI TECH | |
| NPTEL-Assignment 2 solution | |
| Solution Assignment 2 | |
| VLSI assignment 1 answers | |
| VLSI assignment 1 questions |
| Sl.No | Chapter Name | English |
|---|---|---|
| 1 | Introduction on VLSI Design | |
| 2 | Bipolar Junction Transistor Fabrication | |
| 3 | MOSFET Fabrication for IC | |
| 4 | Crystal Structure of Si | |
| 5 | Crystal Structure contd | |
| 6 | Defects in Crystal + Crystal growth | |
| 7 | Crystal growth Contd + Epitaxy I | |
| 8 | Epitaxy II - Vapour phase Epitaxy | |
| 9 | Epitaxy III - Doping during Epitaxy | |
| 10 | Molecular beam Epitaxy | |
| 11 | Oxidation I - Kinetics of Oxidation | |
| 12 | Oxidation II Oxidation rate constants | |
| 13 | Oxidation III - Dopant Redistribution | |
| 14 | Oxidation IV - Oxide Charges | |
| 15 | Diffusion I - Theory of Diffusion | |
| 16 | Diffusion II - Infinite Source | |
| 17 | Diffusion III - Actual Doping Profiles | |
| 18 | Diffusion IV Diffusion Systems | |
| 19 | Ion - Implantation Process | |
| 20 | Ion - Implantation Process | |
| 21 | Annealing of Damages | |
| 22 | Masking during Implantation | |
| 23 | Lithography - I | |
| 24 | Lithography - II | |
| 25 | Wet Chemical Etching | |
| 26 | Dry Etching | |
| 27 | Plasma Etching Systems | |
| 28 | Etching of Si,Sio2,SiN and other materials | |
| 29 | Plasma Deposition Process | |
| 30 | Metallization - I | |
| 31 | Problems in Aluminium Metal contacts | |
| 32 | IC BJT - From junction isolation to LOCOS | |
| 33 | Problems in LOCOS + Trench isolation | |
| 34 | More about BJT Fabrication and Realization | |
| 35 | Circuits + Transistors in ECL Circuits | |
| 36 | MOSFET I - Metal gate vs. Self-aligned Poly-gate | |
| 37 | MOSFET II Tailoring of Device Parameters | |
| 38 | CMOS Technology | |
| 39 | Latch - up in CMOS | |
| 40 | BICMOS Technology |
| Sl.No | Language | Book link |
|---|---|---|
| 1 | English | |
| 2 | Bengali | Not Available |
| 3 | Gujarati | Not Available |
| 4 | Hindi | Not Available |
| 5 | Kannada | Not Available |
| 6 | Malayalam | Not Available |
| 7 | Marathi | Not Available |
| 8 | Tamil | Not Available |
| 9 | Telugu | Not Available |
Analog VLSI Design
| Course Status : | Completed |
| Course Type : | Elective |
| Duration : | 12 weeks |
| Category : | |
| Credit Points : | 3 | Undergraduate/Postgraduate |
| Start Date : | 24 Jul 2023 |
| End Date : | 13 Oct 2023 |
| Enrollment Ends : | 07 Aug 2023 |
| Exam Registration Ends : | 18 Aug 2023 |
| Exam Date : | 29 Oct 2023 IST |
IMAGES
COMMENTS
Question Bank VLSI-DESIGN . DEPARTMENT OF ELECTRONICS AND INSTRUMENTATION ENGINEERING
VLSI Design |1 VLSI DESIGN 2 MARK QUESTIONS & ANSWERS 1.What are four generations of Integration Circuits? _ SSI (Small Scale Integration) _ MSI (Medium Scale Integration) _ LSI (Large Scale Integration) _ VLSI (Very Large Scale Integration) 2.Give the advantages of IC? _ Size is less _ High Speed _ Less Power Dissipation 3.Give the variety of Integrated Circuits? _ More Specialized Circuits ...
VLSI Questions and Answers - VLSI Design This set of VLSI Multiple Choice Questions & Answers (MCQs) focuses on "VLSI Design".
This article lists 100+ VLSI Design Technology MCQs for engineering students. All the VLSI Design Technology Questions & Answers given below include a hint and wherever possible link to the relevant topic. This is helpful for the users who are preparing for their exams, interviews, or professionals who would like to brush up their fundamentals on the VLSI Design Technology topic.
CSE 40462 VLSI Design Homework 1 See website for due date.
CMOS Digital VLSI Design. This course brings circuit and system level views on design on the same platform. The course starts with basic device understanding and then deals with complex digital circuits keeping in mind the current trend in technology. The course follows a design perspective, starts from basic specifications and ends with system ...
hat. is pull-down device?38. How reliability of a VLSI circuit is related. it. power dissipation?39. How environment is affected by the power diss.
Department of Electrical Engineering, IIT Palakkad EE5011: VLSI Design, Assignment- Max Marks-: Instructions: [i] Answer all questions. [ii] Each question carries marks stated against it In class, we graphically determined the transfer characteristics of a static CMOS inverter. Derive analytic expres- sions forVoutas a function ofVinfor regions B, C and D of the transfer function shown in Fig ...
2 MARK QUESTIONS & ANSWERS 1 are four generations of Integration Circuits? _ SSI (Small Scale Integration) _ MSI (Medium Scale Integration) _ LSI (Large Scale Integration) _ VLSI (Very Large Scale Integration) 2 the advantages of IC? _ Size is less _ High Speed _ Less Power Dissipation 3 the variety of Integrated Circuits? _ More Specialized Circuits _ Application Specific Integrated ...
Modules / Lectures Watch on YouTube Video Assignments Download Videos Transcripts Books CMOS Digital VLSI Design
Contact us. Courses. Electronics & Communication Engineering. VLSI Technology (Video) Syllabus. Co-ordinated by : IIT Madras. Available from : 2009-12-31.
VLSI Design assignment questions in microcontroller department of electronics and communication engieeriny assignment questions class: vi semester ece name of
Analog VLSI Design. This course is aimed at introducing analog circuits from the perspective of designing amplifiers in an integrated circuit using MOS transistors. The students will be introduced to the techniques required for designing amplifiers using negative feedback as the guiding principle. Small signal characteristics of widely used ...
Assignment questions p21vlp09 interconnections and packaging for vlsi assignment questions s.no. register no unit no. assignment topics 711322304001 multilevel
CMOS Digital VLSI Design | Assignment 2 | NPTEL 2024 Hanuman's View 1.66K subscribers 13 1.5K views 2 weeks ago #swayam #nptelanswers #nptelassignmentanswers
Prof. Vinay design and verification with system verilog question bank with hints what is type discuss is the limitation of type the advantages of type in